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  Product Center  Solder Solder Paste
 

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Soldering tin paste is the most important joint material for modern printing wiring board and surface makeup technique(SMT).It is determinative factor for ideal and steady soldering effect that chooses appropriate tin paste.Its alloy composition and content and flux type should be conceerned.

Alloy
Melting point
Slolid phase line temperature
Liquid phase line temperature
Tin63 lead37
183
263
188
299
Tin10 lead90
Tin62 lead36 silver2
179
268
221
179
302 
221
Tin10 lead88 silver2
Tin96.5 silver2
Tin43 lead43 silver14
114
139
163
139
Tin43 silver57
Tin99.7 copper0.3
227
227

Tin powder code
Code
Diameter
Applicable clearance
Type 2
-220+325
47-75
1.70-2.90
Standard clearance(<25mil/0.65mm)
Type 3
-325+500
25-45
0.90-1.70
Small clearance(<20mil/0. 5mm)
Type 4
-400+625
20-38
0.75-1.45
Extreme small clearance

The tin powder is made by azotes environment and strict quality control. It has the advantages of high purity. low oxygen conetent and accordant granule distributing. For storage of fresh tin and without oxygenation.each package of tin is stored by vacuum packing.
      Storage of solder paste
The solder paste shuld be stored in refringeration at 3-7 as it arrives. Please note that,never store the solder paste in freezing. On the other hand, if htere is some solder paste left after a assembly process and you hope to use it in the next assembly process, the left solder paste should be stored in a container, sealed and left at room temperature.Please note that, once the solder paste is unsealed, it should not be re-refringerated.
      Preparstion befor printing the solder paste
Prior to printing, the solder paste must be handled correctly as the folowings:
Do not remove any seal until the solder paste has warmed naturally to room temperature. The typical warming or stabilizing time for solder paste is 4-6 hours.
After the solder paste has reached ambient temperature, stirring/mixing is necessary before printing in order to ensurea uniform distribution of any separate material throughout the solder paste. Stir the paste lightly and thoroughly in one direction for one three minutes using a special mixing equipment is recommended.
 
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